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NATIONAL DESIGN CHALLENGE CONTEST

INNOVATING SOLUTIONS, EMPOWERING ENGINEERS

📅 OCTOBER 23-25, 2025 | Registrations Closed

REGISTRATIONS CLOSED

Days

Hours

Minutes

Seconds

🎯 Contest Highlights

🔧 DESIGN, BUILD, INNOVATE

Powered by TI Kits - Experience cutting-edge embedded systems development with MSPM0 microcontrollers

🏭 TI EXPERIENCE TOUR

Get exclusive insights into Texas Instruments' world-class facilities and engineering practices

💰 CASH REWARDS

Exciting prizes and cash rewards for top-performing teams, plus participation certificates for all

3 DAYS OF INTENSIVE INNOVATION

OCT 23-25 2025

Three days of workshops, hands-on training, and competitive development in collaboration with TI

📋 Event Agenda

Day 1: MSPM0 Microcontroller Workshop (6 Hours)

  • CPU (ARM Cortex-M0+ processor core) Architecture
  • Memory Subsystem (Flash/FRAM & SRAM)
  • Communication Modules (I2C, SPI, UART, CAN)
  • Timers and PWM Configuration
  • GPIO and Analog Modules (ADC, OpAmps, Comparators)
  • SDK and Development Tools Overview

Day 2: Design Challenge Contest

  • Team Strategy Session: Teams will brainstorm, divide roles, and plan their approach to solving the problem.
  • Hands-On Work: Participants start working on coding, designing circuits, or developing solutions using TI tools and kits.
  • Mentor Guidance: Mentors and TI experts may interact with teams, clarifying doubts and providing technical guidance.
  • Checkpoint / Milestone Submission: Teams need to show progress at certain intervals or submit partial results for review.

Day 3: Evaluation and Validectory

  • Final Idea Submission & Review Process
  • Technical Evaluation & Judging
  • Prize Distribution & Networking

🚀 Challenge Themes

🌐

Internet of Things (IoT)

Students can use MSPM0 Launchpad with communication modules (UART, I2C, SPI, CAN) to build IoT systems that sense, transmit, and monitor data, enabling applications like smart homes, agriculture, and industrial automation.

🤖

AI & Machine Learning

Using MSPM0 with SDK and training resources, students can integrate lightweight ML models for edge decision-making, enabling predictive maintenance, health monitoring, and adaptive embedded systems without relying on cloud computation.

🔐

Cybersecurity

Students can implement secure communication protocols on MSPM0 Launchpad, leveraging memory protection, authentication, and encryption libraries to design embedded systems resistant to data breaches in IoT, automation, and connected applications.

🔋

Power Efficiency & Sustainability

Leveraging MSPM0’s low-power modes, timers, and efficient memory subsystems, students can design eco-friendly devices for long-term IoT deployment, such as smart meters, wearable trackers, and renewable energy monitoring solutions.

🦾

Automation & Robotics

Students can integrate BOOSTXL-EDUMKII with MSPM0 Launchpad to control motors, sensors, and actuators, enabling robotic arms, autonomous vehicles, and intelligent surveillance systems with real-time control and embedded decision-making.

🖥️

Embedded GUI

By combining MSPM0 with GUI libraries and display drivers, students can design intuitive human-machine interfaces for devices, creating dashboards, control panels, or wearable displays with efficient embedded graphics processing.

🛠️ Hardware & Software Resources

MSPM0 LaunchPad Icon

MSPM0 LaunchPad

Complete development platform with ARM Cortex-M0+ microcontroller

MSPM0 SDK Icon

MSPM0 SDK

Foundational and device support software with comprehensive libraries

MSPM0 Academy Icon

BOOSTXL-EDUMKII

Educational BoosterPack for expanded functionality and sensors

TI Design Materials Icon

TI Design Materials

Reference designs and proven circuit implementations

MSPM0 Academy Icon

MSPM0 Academy

Learning platform with tutorials and technical documentation

MSPM0 Academy Icon

Technical Documentation

Complete datasheets, reference manuals, and schematics

🏆 What You'll Gain

🎁

Exciting Kits

TI development kits for top teams

💵

Cash Prizes

Monetary rewards for winners

🎖️

Certificates

Participation certificates for all

🤝

Industry Exposure

Direct interaction with TI engineers

📋 Contest Guidelines

Submission Requirements

  • Submit proposals (maximum 500 words) as per guidelines
  • Shortlisting based on proposal merit and innovation
  • Maximum 3 participants per team
  • No registration fee required
  • Reference Document: Click Here
  • Proposal Format: Click Here

Key Benefits

  • Exposure to real-world embedded systems problems
  • Multidisciplinary team collaboration experience
  • TI-led mentorship and hands-on guidance
  • Industry-standard development tools training